| 摘要 |
PURPOSE:To provide a method for manufacturing a lead frame which realizes high density wiring with multiple pins, high heat dissipation properties while reducing insufficient bonding, and a production method of semiconductor device. CONSTITUTION:The lead frame comprising leads and islands has such structure as a first lead frame member 2 associated with leads is stuck, at the outer frame, to a second lead frame member 5 having islands and an outer frame including a power supply plane layer 3 and a ground plane layer 4 and a suspension lead 10 coupling the island and the outer frame, wherein inner leads are stretching over the islands. |
