| 摘要 |
A molding apparatus and a molding method are provided which enable leads which project from an electronic housing, such as a housing configured to receive an accelerometer, to be formed during the molding operation in which the housing is formed. As a result, the leads used in the molding operation can be in an as-stamped, unformed condition, so as to facilitate handling and loading of the leads into the molding apparatus. In addition, because forming occurs during the molding operation, subsequent secondary forming operations are not required to achieve the desired configuration for the leads.
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