| 摘要 |
<p>PURPOSE:To obtain the adhesive having high reliability without reflow cracking and useful in semiconductor devices by using an epoxy group-containing polybutadiene, a curing agent, a (meth)acryl group-containing organic compound and a free radical polymerization initiator. CONSTITUTION:The object adhesive comprises (A) an epoxy group-bearing polybutadiene, (B) a curing agent, (C) a (meth)acryl group-having organic compound and (D) a free radical polymerization initiator, preferably further (E) a filler (preferably silver dust). It is preferable that the component (B) is used in an amount of 0.5 to 1.5 equivalent per equivalent of the epoxy group in the component (A), and also the component (C) and the component (D) are used in amounts of 50 to 200 pts.wt. and 0.1 to 10 pts.wt. per 100 pts.wt. of the component (A), respectively.</p> |
