发明名称 Method for packing lead frames for shipment thereof
摘要 A combination magazine and shipping tray for lead frames cut into discrete length strips. The magazine collects discrete length lead frame strips dispensed from an automated lead frame quality inspection machine. A cover, when placed over the magazine, provides a packaging tray for shipment of the collected lead frame strips to a semiconductor integrated circuit packaging facility. At the packaging facility, the cover is removed and the magazine is a loading magazine for loading discrete length lead frame strips into a machine used for packaging ICs.
申请公布号 US5448877(A) 申请公布日期 1995.09.12
申请号 US19940239994 申请日期 1994.05.09
申请人 NATIONAL SEMICONDUCTOR CORPORATION 发明人 CHU, HSIANG
分类号 H01L21/673;(IPC1-7):B65B5/10;B65B25/00 主分类号 H01L21/673
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