发明名称 METHOD FOR CUTTING WITH LASER BEAM AND DEVICE THEREFOR
摘要 PURPOSE:To obtain a method for cutting with laser beam and device therefor to realize a high quality cutting without generating a rough cutting surface by eliminating the stagnation of molten matter at a lower part of the cutting surface of a work to be cut. CONSTITUTION:Cutting is executed while vibrating the irradiating position of a laser beam 1 or the irradiating diameter against the work 6 to be cut during cutting, in order to perform the cutting, a moving means 9 which relatively moves the work 6 to be cut and the laser beam 1, a beam diameter regulating means, or a changeover means is provided.
申请公布号 JPH07236987(A) 申请公布日期 1995.09.12
申请号 JP19940030091 申请日期 1994.02.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKENO YOSHIMIZU;ISAKA HISAO;MORIYASU MASAHARU;KANEKO MASAYUKI;KANEOKA MASARU
分类号 G02B26/10;B23K26/00;B23K26/04;B23K26/06;B23K26/08;B23K26/14;B23K26/38 主分类号 G02B26/10
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