发明名称 Method for fabricating an ultra-high-density alternate metal virtual ground ROM
摘要 The present invention provides an alternate metal virtual ground (AMG) read only memory (ROM) array formed in a silicon substrate of P-type silicon. The array includes a ROM cell matrix which is defined by a plurality of rows and a plurality of columns of ROM data storage cells. The AMG ROM array includes a plurality of parallel, spaced-apart buried N+ bit lines formed in the silicon substrate. Alternate buried N+ bit lines are contacted by a conductive metal line at two contact locations within an array segment to thereby define contacted drain bit lines of the ROM cell matrix. Each buried N+ bit line that is between two adjacent contacted drain bit lines is non-contacted. Each non-contacted bit line is segmented into a length sufficient to form the segmented source bit line for a preselected plurality of ROM data storage cells, thereby defining a column of the ROM data storage cells in the ROM segment. That is, a first column of ROM data storage cells is connected between the segmented source bit line and the first adjacent contacted drain bit line. A second column of ROM data storage cells is connected between the segmented source line and the second adjacent contacted drain bit line.
申请公布号 US5449633(A) 申请公布日期 1995.09.12
申请号 US19940327319 申请日期 1994.10.21
申请人 NATIONAL SEMICONDUCTOR CORPORATION 发明人 BERGEMONT, ALBERT
分类号 H01L21/8246;H01L27/112;(IPC1-7):H01L21/265 主分类号 H01L21/8246
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