| 摘要 |
PURPOSE: To provide a package of a semiconductor manufactured by batch with a low cost with smaller size and weight than those of prior art and superior high-frequency operation. CONSTITUTION: A base 1 having a plurality of recesses 9 is provided, a plurality of sets of first openings 5 at an interval extended to the entire base 1 and each surrounding one of the recesses 9 are formed, and a plurality of sets of second openings 7 partly extended to the base 1 are formed. Further, one set of the openings 7 are connected to each other to a pair of adjacent openings from one of each set of the openings 5, partly extended to the base 1, continuous groove surrounding one of the recesses 9 is formed, and then the opening 7 is extended to the entire base 1, and individual packages 3 for coupling the recesses 9 are formed. The opening 7 is extended to the entire base 1, and residual part of the base 1 disposed in the opening 7 is removed by impact to isolate a package 3. |
