发明名称 METHOD AND EQUIPMENT FOR DIE BONDING
摘要 PURPOSE:To automatically correct the fluctuation of resin discharge amount and always maintain a constant resin discharge amount, by controlling discharge conditions so as to compensate the difference between the integrated value of the effective components of a detected pressure waveform which exceed a specified threshold level and the integrated value of the effective components of a reference pressure waveform which exceed the specified threshold level. CONSTITUTION:The effective components which exceed a specified threshold level are integrated with an integral circuit 23, and the integrated value is stored in a reference value memory 26. Resin 4 is discharged by the operation of a pressurizing equipment 7, and the pressure of high pressure gas changes according to the resin amount in a resin vessel 3. The pressure change is detected with a pressure sensor 27, subjected to A/D conversion with an A/D converter 21, and stored in a memory 22. The effective components which exceed a specified threshold level are integrated with the integral circuit 23. This integrated value is compared with the integrated value from the reference value memory 26, and the difference between the detected value and the reference value is obtained with an operation part 25. In orde to compensate the difference, the operation part 25 outputs a command to a discharge time controlling part 8, so as to lengthen the operation time of an electromagnetic valve.
申请公布号 JPH07240427(A) 申请公布日期 1995.09.12
申请号 JP19940211438 申请日期 1994.09.05
申请人 TOSHIBA CORP 发明人 SATO TAKEO;SHIMIZU YASUHIKO
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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