PRODUCTION OF CERAMIC MULTILAYER WIRING BOARD

摘要

PURPOSE:To provide a method for producing a ceramic multilayer wiring board mounting a semiconductor device in which a via can be made within a predetermined pad forming region even if a ceramic laminate shrinks at a rate different from a standard rate in different direction. CONSTITUTION:An imaginary pad 30-S is set on the uppermost layer green sheet 21-1 while taking account of a standard shrinkage rate and vias 25-1, 25-2 are made at two point on a selected diagonal of he imaginary pad 30-S on the opposite sides of the center. The uppermost layer green sheet 21-1 is then laminated along with a plurality of other green sheets, pressed and fired to form a pad 30 to be bonded to a semiconductor device 10 on the surface of the uppermost layer ceramic sheet 21.