发明名称 CAPACITIVE BOND STRUCTURE
摘要 PURPOSE: To couple a circuit at ambient temperature to a superconducting circuit of low temperature, without almost accompanying thermal conduction by disposing a microwave probe head at a suitable interval above both ends of a board, so that a probing pin is disposed on an electroconductive ground plane and superconducting center line. CONSTITUTION: This capacitive coupling structure is provided with a superconducting waveguide 5 coupled to a superconducting element 1 on a board 4, extended to one end of the board 4 and formed of an oxide superconductor for transmitting a microwave to the element 1, a pair of superconducting ground planes 6 of oxide superconductors sandwiching the end of the waveguide 5 at a small interval, and three probing pins 31, 32, 33 corresponding to the waveguide 5 and plane 6. Microwave probe heads 21, 22 connected to the circuit of the ambient temperature and having a small gap are disposed on the waveguide 5. Therefore, microwave is efficiently transmitted from the pins to the waveguide.
申请公布号 JPH07240540(A) 申请公布日期 1995.09.12
申请号 JP19940110489 申请日期 1994.04.26
申请人 SUMITOMO ELECTRIC IND LTD;UNIV MARYLAND 发明人 NAKAMURA TAKAO;ARUPU TEII FUINDEIKOGUU
分类号 H01L39/22;G01R1/04;G01R33/035;H01P1/00;H01P5/02;H01P5/08;(IPC1-7):H01L39/22 主分类号 H01L39/22
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