| 摘要 |
In a process for producing circuit boards or inner layers of circuit boards containing rigid and flexible parts, at every part which is to be flexible a laminar piece which is identical in its dimensions to said part is punched out of the rigid insulating material layer before the lamination of the individual-layer composite and is reinserted as a filling piece immediately thereafter as an exact fit into the punched window by the reverse procedure. <IMAGE> |
