| 摘要 |
PURPOSE:To conduct stable polishing at all times in the case of polishing a chamfering part of a wafer using a tape for carrying fixed abrasion grains by freely moving the tape wound on a rotary drum relatively to a polished object by means of rotation and the like of a take-up reel. CONSTITUTION:A wafer W is sucked to a suction part 80 of a wafer holding mechanism 8 and a chamfering part of the wafer W is brought into contact with a tape T wound on an outer periphery of a rotary drum 2 by means of an air cylinder 82. At the time of polishing, the wafer W is rotated around an axis 86 by a motor 85 to move a polishing part of the wafer W in the circumferential direction and simultaneously the tape T is moved by driving of a motor 6. At the same time, the tape T spirally wrapped on the rotary drum 2 is moved to successively deliver a fresh face by rotation of a take-up reel 4, an appropriate relative speed is obtained between the chamfering part and the tape T by rotation of the rotary drum 2, and excellent polishing can be stably conducted. |
