MOUNTING STRUCTURE FOR FET CHIP IN MICROWAVE HYBRID INTEGRATED CIRCUIT

摘要

PURPOSE:To provide the mounting structure of an FET chip with less insertion loss and reflection loss and reduced in manufacturing man-hours. CONSTITUTION:The FET chip 1 is mounted and fixed on a transmission conductor 5, the source electrode 4 of the FET chip 1 is connected to the transmission conductor 5 by a wire 6 and a drain electrode 3 is connected to a ground conductor 9 in terms of a high frequency by connecting the drain electrode 3 to a 1/4 wavelength open stub 7 attached on the dielectric substrate 8 of a strip line by the wire 13. Also, by connecting the transmission conductor 5 to the ground conductor 9 by using a high impedance line 10, the DC round of the FET chip 1 is provided.