ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a manufacturing method for a semiconductor device using a superconducting ceramic material, and more particularly to a manufacturing method for a semiconductor device wherein one part or all of the connecting wiring in the semiconductor device is formed from a superconducting ceramic material and wherein the semiconductor device can be activated at a low temperature such as 70 DEG K to 100 DEG K, or ideally 77 DEG K. The semiconductor of the present invention comprises a semiconductor substrate with at least one element provided within this semiconductor substrate and a superconducting material with zero electrical resistance formed on this substrate or on the upper surface of the insulating film or on the conductor with the superconducting material being selectively etched and patterning being performed on the substrate.