| 发明名称 |
SEMICONDUCTOR PACKAGE MANUFACTURE METHOD |
| 摘要 |
The die bonding process includes making a mask bonding face of a lead frame, and bonding a chip on the lead frame by printing an insulation material being a thermo-plastic adhesive. Pref. an inner lead of the lead frame and die are bonded together by dotting the adhesive on the inner lead and the chip. The process can minimize the covered area of the adhesives.
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| 申请公布号 |
KR950010111(B1) |
申请公布日期 |
1995.09.07 |
| 申请号 |
KR19920014926 |
申请日期 |
1992.08.19 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SO, DONG - SU;CHOE, WAN - KUN |
| 分类号 |
H01L21/52;H01L21/56;H01L21/60;H01L23/28;H01L23/29;H01L23/31;H01L23/50;(IPC1-7):H01L23/28 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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