Connecting electronic circuits in a multi-chip module having a co-fired substrate

摘要

A multi-chip module has a co-fired substrate (5), and, on at least one face of the substrate, a set of superimposed ceramic insulating layers (11), fired at a temperature substantially smaller than the firing temperature of the substrate. Conducting interconnection lines are formed in thick layers (12) deposited between the ceramic insulating layers (11). Electronic components (15) are mounted at the surface of the set of ceramic layers (11).