| 摘要 |
<p>PURPOSE:To obtain an adhesive tape suitable for sticking a semiconductor wafer or the like for forming a semiconductor pellet, by sticking and forming a two-layered structure adhesive layer, in which the upper layer is an ultraviolet curing type first adhesive layer and the lower layer is an ultraviolet noncuring type second adhesive layer, to a flexible substrate. CONSTITUTION:A pellet 1 is stuck to an adhesive sheet 10 which is formed by laminating a two-layered structure adhesive layer comprising an ultraviolet curing type first adhesive layer 12a and an ultraviolet noncuring type second adhesive layer 12b on a flexible sheet substrate 11. After the adhesive sheet 10 is irradiated with ultraviolet rays from below the sheet, and the first adhesive layer 12a is cured, the adhesive sheet 10 is pushed up from below. The pellet 1 peeled from the interface of the first adhesive layer 12a and the second adhesive layer 12b is clamped by vacuum suction, and the second adhesive layer 12b is mounted, as second adhesive agent, on a surface to be fixed. Thereby the sticking process of adhesive agent for mounting and its equipment are reduced, so that productivity is improved and cost is reduced.</p> |
