发明名称 |
Lead carrier |
摘要 |
Two device holes are formed in a base film such that the device holes are juxtaposed in a width direction of the base film perpendicular to a feed direction of the base film. An outer lead hole is formed in the base film with a distance from the device holes in the feed direction. A first lead wire group is arranged on the base film between the outer lead hole and one of the device holes, and a second lead wire group is arranged on the base film between the outer lead hole and the other device hole. Further, a third lead wire group is arranged on the base film between both device holes. |
申请公布号 |
US5448451(A) |
申请公布日期 |
1995.09.05 |
申请号 |
US19930154442 |
申请日期 |
1993.11.19 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TAKUBO, CHIAKI;IKEBE, KIMIHIRO;TAKEUCHI, MASAFUMI;HIRATA, SEIICHI;TAKEDA, SUMIO |
分类号 |
H01L21/60;H01L23/50;H01L23/538;(IPC1-7):H05K1/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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