| 摘要 |
PURPOSE:To prevent solder balls, flux residues, solvents vapor, moisture, etc., from entering the gaps between a printed board and surface-mount parts during the mounting process by providing insulators in the gaps. CONSTITUTION:One or more insulators 1 of materials having softness and heat resistance are provided in a gap between a printed board 3 and a surface-mount part. Besides, weirs are made of insulators between the foot patterns 11 of the printed board 3 corresponding to between the lead roots of leads 15. Consequently, it becomes possible to prevent unnecessary chemical reaction on the printed board and to secure the high-reliability of the mounting on the printed board. Besides, this method eliminate the use of fluorocarbon. |
