| 摘要 |
Disclosed is a plating device for plating a wafer, in which the resist film formed on a wafer need not preliminarily be removed, and plurality of needle-like electrodes can stably and reliably be contacted with the wafer to secure electrical continuity therewith and attachment of the plating metal onto the needle-like electrodes can effectively be prevented. Referring to the constitution of the plating device, the periphery of the wafer is pressed against the mounting surface provided around the opening edge of a plating tank with the aid of a holding means, and the wafer is as such brought into contact with the plating solution contained in the plating tank to carry out plating treatment, in which needle-like electrodes are provided in such a way that the tips thereof may slightly protrude above the mounting surface and that they may elastically be deformed to be retractable below the mounting surface; and the needle-like electrodes are pressed by the wafer which is pressed and elastically deformed by the holding means against the mounting surface to remove the resist film present at the contacted portion utilizing the force of press contact to acquire electrical continuity between the needle-like electrodes and the wafer.
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