| 摘要 |
PURPOSE:To enable even a flip chip type LED to be applicable to an LED lamp by a method wherein a package is formed of transparent resin, and the electrode of a flip chip type LED comprised in LED chips is bonded spreading over two leads out of leads in a chip bonding region. CONSTITUTION:A package 2 is formed of light transmitting resin, and an LED lamp 1 is formed into the shell-shaped package 2 provided with leads 4 which extend outwards. The tips of the leads 4 located inside the package are formed into the shape of hangers by bending for the formation of chip pads (bonding region) where LED chips are mounted, and a flip chip-type (face-down) blue chip is bonded to two leads 4 bridging a space between them. Or, a red LED chip is directly mounted on the chip pad of the leads 4 of a common anode and connected to a lighting terminal with a bonding wire. |
