| 摘要 |
PURPOSE: To realize test of a substrate from its both side by forming a connection surface electrically connected with one electrically-conductive filler on a surface of a support plate adjacent to a first main surface, abutting the connection surface against contacts on the first main surface, and fixedly coupling the connection surface with the respective contacts. CONSTITUTION: In order to integrate a first substrate 21 and a second substrate 31 into a single cubically integrated circuit device, the second substrate 31 is mounted on a surface of a first support plate 24 opposite to the first substrate 21. In this case, a contact 33 on a second main surface 36 of the second substrate 31 abuts against a connection surface 25 of the support plate 24. Soldering or amalgam formation causes the contact 33 to be connected fixedly to the connection surface 25. At the same time as the fixed connection, coupling between the second substrate 31 and first support plate 24 is established. In this way, the first substrate 21 and second substrate 31 are connected with each other electrically and mechanically, through the first support plate 24. |
