Cooling of semiconductor power modules by flushing with dielectric liquid

摘要

Semiconductor dies (30-40) are mounted on a printed wiring board (28) to be vertically oriented. They are enclosed in a housing (12) which is supplied with an upwardly flowing dielectric liquid coolant. Nozzles (18,20) direct the dielectric liquid coolant to flow upward over the dies and printed wiring board. Heat is directly extracted from the dies.