| 摘要 |
PURPOSE:To form a resist patten which has high resolution and is excellent in sectional form and heat resistance and to obtain high sensitivity, focal depth and width characteristic and enough exposure margin by using alkalic soluble resin and a specified photosensitive component. CONSTITUTION:A positive type photoresist composition contains alkali soluble resin and photosensitive components, and the photosensitive components are quinone diazide sulfonic acid and one kind of an ester compound selected from compounds expressed by the following formula. The rate of esterification is 50% or more, and the diester percentage content is 60% or more on the molar basis. In the formula, k, l and m are integers from 1 through 3, and n is 1 or 2. Thus, a resist pattern which has high resolution, and is excellent in sectional form and heat resistance can be formed. It has high sensitivity and is excellent in focal depth and width characteristic and antihalation effect, and enough exposure margin can be obtained. |
