发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PURPOSE:To facilitate the selective growing step of a semiconductor on a transparent conductive film in a method of manufacturing semiconductor device including the semiconductor selective growth step on the transparent conductive film. CONSTITUTION:The manufacturing method of semiconductor device is composed of the three steps as follows, i.e., the first step of forming a conductive film comprising a metal, a metallic oxide or an intermetallic compound on an insulating film 1, the second step of forming a growing neucleus layer 5 containing either one element out of group IIIb, group IVb, group Vb and group VIIb neither comprising the conductive film 3 nor the insulating film 1 and the third step of selectively growing a semiconductor 6 on the growing neucleus layer 5.
申请公布号 JPH07235502(A) 申请公布日期 1995.09.05
申请号 JP19940049528 申请日期 1994.03.18
申请人 FUJITSU LTD 发明人 TAKIZAWA YUTAKA;YANAI KENICHI
分类号 H01L29/40;G02F1/1362;H01L21/20;H01L21/205;H01L21/336;H01L29/78;H01L29/786;H01L31/04;H01L31/18;(IPC1-7):H01L21/205 主分类号 H01L29/40
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