| 摘要 |
PURPOSE:To lessen a board in area and a multi-chip module in cost by a method wherein semiconductor chips 2a and 2b are mounted on both the sides of the board, and the multi-chip module excellent in heat dissipating properties is provided. CONSTITUTION:A multi-chip module is equipped with a board 1 on whose sides parts (chips) are mounted, the parts mounted on the first side of the board 1, the other parts mounted on the second side of the board 1, and a heat dissipating block 6 which is mounted on the second side of the board 1 at a prescribed spot confronting the part 2a which is out of the parts mounted on the first side and comparatively large in heat releasing value and all sealed up with a molding resin 5. |
