| 发明名称 |
Method of fabricating a semiconductor device package |
| 摘要 |
A process wherein those parts of a lead frame that are outside a cavity are directly supported by ejecting pins extending from above and from below when the lead frame is sandwiched between an upper die and a lower die. The ejecting pins eject the lead frame, on which a package is formed, after a resin mold process.
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| 申请公布号 |
US5447888(A) |
申请公布日期 |
1995.09.05 |
| 申请号 |
US19940194343 |
申请日期 |
1994.02.08 |
| 申请人 |
FUJITSU LIMITED;KYUSHU FUJITSU ELECTRONICS LIMITED |
发明人 |
TAKASHIMA, AKIRA;HONDA, TOSHIYUKI;WAKI, MASAKI |
| 分类号 |
B29C45/14;H01L21/56;(IPC1-7):H01L21/56;H01L21/603;B29C45/02 |
主分类号 |
B29C45/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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