| 摘要 |
<p>PURPOSE:To provide the treatment apparatus capable of detecting the deformation of a wafer boat holding workpieces (wafers) popping, etc., of the workpieces. CONSTITUTION:Within the treatment apparatus wherein a plurality of workpieces (W) are shifted to a wafer boat 10 which is contained in a treatment chamber 12 for heat treatment, for example, an abnormality detecting sensor 68 comprising e.g. a distance sensor is arranged above the wafer boat 10. Next, the periphery of the sensor 68 is irradiated with e.g. laser beams in the long direction thereof to detect the reflected beams thereby enabling the deformation of the wafer boat 10 or the popping, etc., of the workpieces (W) to be detected.</p> |
