| 摘要 |
<p>PURPOSE:To improve the cooling capability and the cooling efficiency of a wafer chuck, cool a semiconductor wafer uniformly, and realize the probe inspection of a semiconductor integrated circuit device chip having a large heating value. CONSTITUTION:The following are installed; a specimen stage 2 having a mounting surface for mounting a semiconductor wafer 1 wherein a plurality of chips composed of a plurality of semiconductor elements are formed on the main surface, a cavity 3 formed in the specimen state 2, a refrigerant fluidization means 8 for fluidizing refrigerant 9 so as to bring it into contact with the whole surface of the specimen mounting side of the inner wall of the cavity 3, and a cooling means 7 for cooling refrigerant 9 in a flow channel of the refrigerant fluidization means 8. A nozzle 10 jetting the refrigerant 9 so as to bring it into contact with the whole surface of the specimen mounting side is installed in the cavity 3. The nozzle 10 is arranged so as to correspond to chip mounting positions. An adjust fixing means 12 fixes the mounting position of the semiconductor wafer 1 so as to coincide with the position of the nozzle 10. The refrigerant 9 is fluorine-based inert liquid.</p> |
