| 摘要 |
<p>PURPOSE:To restrict the descent amount of a stage within a small range, and reduce the disorder of horizontal precision which is generated at the time of descending, by performing positioning by setting the bonding pad of a chip IC to the cursor lines in the X and Y directions on an image monitor. CONSTITUTION:Positioning is performed as follows. Inverting mechanism is installed and makes a chip IC 1' and a prober 2 face each other. Before the chip IC 1' is mounted on a stage 1 and inverted, the pin tip position of the prober 2 is previously displayed on an image monitor by cursor lines 3' in the X direction and the Y direction. The pad of the IC chip 1' is aligned with the cursor lines 3'. A positioning guide 10 is installed on a stage 1. The guide 10 is worked in order to escape from the burr generated on the end surface of the chip IC 1'. A second or layer chip IC 1' is positioned only by setting the end surface of the chip IC 1' to the guide 10. A stopper is formed on a descending shaft, and the pushing amount against the prober 2 is adjusted only by bringing the stage 1 into contact with the stopper.</p> |
