| 摘要 |
<p>PURPOSE:To prevent the clogging of a nozzle, solidification of the paste, etc., due to the precipitation of the filler that is contained in the paste and used for improving the thermal conductivity and resistivity of the paste from occurring and to enable the use of the paste having excellent physical properties over a long period by providing a paste dropping device for bonding the semiconductor chip with a filler-precipitation preventive mechanism. CONSTITUTION:In this device, the helical screw 4 having plural holes 5 is formed in the inside of the cylinder 1 and normally rotated to agitate the paste 2. Therefore, failures such as the clogging of the nozzle, solidification of the paste, etc., due to the precipitation or aggregation of the filler can be prevented from occurring and the paste 2 having excellent physical properties can be used over a long period.</p> |
