NON-CYAN COPPER-ZINC ELECTROPLATING BATH, SURFACE TREATMENT OF COPPER FOIL FOR PRINTED CIRCUIT BOARD USING THE BATH, AND THE COPPER FOIL FOR PRINTED CIRCUIT BOARD

摘要

PURPOSE:To produce the copper foil for a printed circuit board excellent in migration resistance by forming a C-contg. Cu-Zn coating layer with the specified composition on the surface of the copper foil and further forming a chromating layer and a silane coupling layer thereon. CONSTITUTION:A copper foil is dipped in a non-cyan Cu-Zn plating bath of an aq. soln. contg. 5-60 gel copper salt such as copper sulfate, 2-30g/l zinc salt such as zinc sulfate, 20-120g/l oxycarboxylic acid or the salt such as Na glucoheptonate, 20-120g/l aliphatic dicarboxylic acid or the salt such as K oxalate and 1-20g/l. thiocyanic acid or its salt such as K thiocyanate and cathodized to form a Cu-Zn coating layer contg. 40-90 atomic % Cu, 5-50% Zn and 0.1-20% C. A chromating layer and a silane coupling layer are further formed thereon to produce the copper foil for a printed circuit board excellent in migration resistance.