发明名称 LIQUID CRYSTALLINE RESIN MOLDING
摘要 PURPOSE:To obtain the subject molding useful for electricity/electron related devices, having excellent heat resistance, mechanical characteristics, dimensional accuracy and weld strength by adding a specific olefinic polymer to a liquid crystalline polyester or a liquid crystalline polyamide. CONSTITUTION:(A) 100 pts.wt. of a liquid crystalline resin composed of a liquid crystalline polyester and/or a liquid crystalline polyamide showing an anisotropic melt phase is mixed with (B) 0.01-2 pts.wt. of an olefinic polymer having 10,000-600,000 weight-average molecular weight (polyethylene, polypropylene, a copolymer of ethylene and a >=3C a alpha-olefin, a copolymer of propylene and a >=4C alpha-olefin, a copolymer of ethylene, a >=3C alpha-olefin and a nonconjugated diene and/or a copolymer of propylene, a >=4C a alpha olefin and a nonconjugated diene) and melted and molded at the melting point of the component A+10 deg.C (90 deg.C mold temperature) to give a molding having 6.0mm width X127mm length X1mm thickness and >=15% weld strength retention ratio.
申请公布号 JPH07233310(A) 申请公布日期 1995.09.05
申请号 JP19940326469 申请日期 1994.12.27
申请人 TORAY IND INC 发明人 NAKAMURA SEIICHI;KITAJIMA NORIO;INOUE SHUNEI
分类号 C08J5/00;C08L67/00;C08L77/00;C08L77/12;(IPC1-7):C08L67/00 主分类号 C08J5/00
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