Radiating fin having an improved life and thermal conductivity

摘要

A semiconductor device has a heat radiating fin attached to a semiconductor packaging device which holds a semiconductor element for externally diffusing heat generated by the semiconductor element. The fin is light in weight and has an improved thermal conductivity, since the heat radiating fin is made of an aluminum alloy or of a pure aluminum secured to a connecting member by a direct metallic bond. The connecting member is made of a Mo-Cu composite material. The fin and the connecting member are friction welded to each other to form the metallic bond at an interface between the fin and the connecting member.