发明名称 Method of manufacturing a pattern of an electrically conductive polymer on a substrate surface and method of metallizing such a pattern
摘要 A solution of monomers, oligomers or polymers and a suitable oxidation agent can be stable if the solution also comprises a base. By spin coating this solution onto a substrate, a layer can be formed which, after patterned irradiation, yields a pattern of a doped conductive polymer which is formed in situ, the exposed and unexposed areas exhibiting a large difference in conductivity. A description is given of, inter alia, the patterned irradiation of a layer of 3,4-ethylenedioxythiophene. If desired, the conductive polymer pattern can subsequently be metallized in an electroplating bath. The method provides, inter alia, a simple process of manufacturing metal patterns on insulating substrates, such as printed circuit boards.
申请公布号 US5447824(A) 申请公布日期 1995.09.05
申请号 US19940207560 申请日期 1994.03.07
申请人 U.S. PHILIPS CORPORATION 发明人 MUTSAERS, CORNELIUS M. J.;DE LEEUW, DAGOBERT M.;SIMENON, MAURICE M. J.
分类号 H05K3/10;C08G61/12;H01B1/12;H05K3/18;H05K3/24;(IPC1-7):G03F7/20;H01B1/06 主分类号 H05K3/10
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