发明名称 COATING COMPOSITION FOR IN-MOLD COATING MOLDING
摘要 PURPOSE:To obtain a coating composition used as a coating material which can give a coated molding excellent in impact resistance and adhesion of coating layer in a in-mold coating molding process. CONSTITUTION:This composition is one comprising a thermosetting resin having reactive unsaturated bonds, an epoxy resin and a nitrogenous epoxy resin curing agent, a polycarboxylic acid or a polymercaptan, and optionally a polyisocyanate, a blocked isocyanate, an unsaturated isocyanate, an unsaturated isothiocyanate or an unsaturated glycidyl compound.
申请公布号 JPH07233242(A) 申请公布日期 1995.09.05
申请号 JP19940026706 申请日期 1994.02.24
申请人 SEKISUI CHEM CO LTD 发明人 MORISHITA NATSUKI;TSUJI TOSHIMITSU
分类号 B29C39/10;B29C43/20;B29C45/14;B29K63/00;C08G59/40;C08G59/50;(IPC1-7):C08G59/50 主分类号 B29C39/10
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