Memory stack with an integrated interconnect and mounting structure

摘要

A memory stack includes a flexible interconnect device having a plurality of rigid sections connected together by a plurality of flexible sections. Memory devices such as dice or chips are mounted on the flexible interconnect structure and the structure is folded to at the flexible sections to form a stack. Connections among memory device I/Os and interconnect device mounting contacts are made via traces in a signal layer. A thermal conduction layer can be added to increase heat conduction away from the memory devices.