| 摘要 |
The glass for sealing of IC ceramic package is composed of 50-80 wt% glass powder having low melting point and 20-50 wt% zinc oxide-solid solution petalite as an inorganic refractory additive having low expansibility. The glass powder having low melting point consists of 65-85 wt% lead oxide, 7-20 wt% boron oxide, 2-6 wt% zinc oxide, 0.05-6 silica and 0.05-3 wt% alumina. The glass is prepared by (a) mixing these oxides powder, melting it at 850-950 deg.C and pulverizing, (b) mixing ZnO, Al2O3 and SiO2 in the molar ratio of 1:1:3, sintering this mixture at 1,500-1,700 deg.C and pulverizing it to produce ZnO solid solution petalite, (c) mixing the two types of the above powders.
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