| 摘要 |
The invention relates to a method for laser-cutting a CVD diamond slab. To this end, the CVD diamond slab, which can be either polycrystalline or monocrystalline, is partially cut through by means of laser light, and is then broken to afford a CVD diamond slab, no electrical conductance taking place between the top face and the bottom face. Good results are achieved if the CVD diamond slab is cut through about 50% of its thickness and if the laser used is Nd-YAG laser light. The thickness of the CVD diamond slab is generally about 100-500 μm. It is important, according to the invention, that the breaking of the lasered CVD diamond slab is carried out in such a way as to produce a good, planar and more or less even break (fracture). Finally, the invention relates to a CVD diamond slab obtained according to the present method. The special feature of the CVD diamond slab obtained according to the invention is that no electrical conductance takes place between top face and bottom face. |
