| 摘要 |
<p>PCT No. PCT/EP96/01747 Sec. 371 Date Feb. 27, 1998 Sec. 102(e) Date Feb. 27, 1998 PCT Filed Apr. 25, 1996 PCT Pub. No. WO96/36675 PCT Pub. Date Nov. 21, 1996This invention discloses a method of bonding a lower substrate with an upper substrate comprising applying an adhesive (56) on at least one of the lower (12) and the upper (14) substrates, and rotating the lower and the upper substrates thereby to create a centrifugal force which causes the adhesive to spread between the lower and the upper substrates with a substantially uniform thickness, while applying a pressure upon the upper substrate thereby to bond the lower and upper substrates. The invention also discloses an apparatus for bonding the lower substrate with the upper substrate.</p> |
