Oberflächenmontage-Verfahren und Vorrichtung.

摘要

Method and device are provided for use in the initial manufacture of surface mount printed circuit board (14) assemblies or for use in the replacement and repair of J-leads surface mount electrical components (12) on printed circuit boards (14). The device comprises socket means (30) for receiving a surface mount electrical component (12), and a plurality of contact elements (32) mounted on said socket means (30), each of said contact elements (32) having a first portion (50) for soldering the contact element (32) to a conductive pad (22) on a printed circuit board (14) and a second portion (52) for soldering said contact element (32) to a J-shaped lead (18) of said electrical component.