Method of manufacturing a contactless card.

摘要

The card, containing an electronic module with an integrated circuit chip and antenna, is made by placing a frame (1) on top of a thermoplastic layer (2) to form a cavity in which the electronic module is placed. The cavity is then filled with a polymerisable resin, eg. a bi-component polyurethane resin, and the frame is covered with an upper layer of thermoplastic film (10) before applying a light pressure (11) - about 1 bar. A second frame (17) is placed round the assembly to determine the final thickness of the card. The electronic module is positioned inside the frame with adhesive and the resin applied from above the frame at two points situated on either side of the module. The procedure is carried out at a temperature of under about 60 degrees C, but at least as high as the temperature at which the resin polymerises.