Source/drain of MISFET in semiconductor device and method of manufacturing the same.

摘要

A MOS transistor consists of a gate insulating film (3), a gate electrode (11), a pair of sidewall spacers (13) on the side faces of the gate electrode (11), lightly doped source/drain regions (4), and heavily doped source/drain regions (16), which are located below the sidewall spacers (13). Between the sidewall spacers and an isolation are formed concave portions (22). On a silicon substrate (1) in the concave portions (22) are formed insulating films (14) for capacitance reduction. On the insulating films (14) for capacitance reduction are formed withdrawn electrodes (15). The heavily doped source/drain regions (16) are electrically connected to the withdrawn electrodes (15) between the sidewall spacers and the insulating films for capacitance reduction. Consequently, a pn junction capacitance beneath the source/drain regions is reduced, while the contact area between the source/drain regions and wiring is surely obtained, thereby achieving higher integration of the MOS transistors. <IMAGE>