发明名称 |
Multilayer metal leadframe and method for making same. |
摘要 |
<p>Prodn. of a lead frame, having a conducting pattern, involves (a) providing a multilayer clad strip having a Cu alloy base layer, an Al or Al alloy conducting layer and a Cu or Cu alloy upper layer; (b) plating the upper layer with a Sn or Sn-Pb alloy layer; (c) selectively cutting away portions of the plated layer and upper layer with a skiving tool to expose a selected pattern of the conducting layer; and (d) removing part of the thickness of the conducting layer.</p> |
申请公布号 |
EP0669648(A2) |
申请公布日期 |
1995.08.30 |
申请号 |
EP19940108381 |
申请日期 |
1994.05.31 |
申请人 |
TECHNICAL MATERIALS, INC. |
发明人 |
MENNUCCI, JOSEPH P. |
分类号 |
H01L23/50;H01L21/48;H01L23/495;(IPC1-7):H01L21/48;H01L23/498 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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