发明名称 Multilayer metal leadframe and method for making same.
摘要 <p>Prodn. of a lead frame, having a conducting pattern, involves (a) providing a multilayer clad strip having a Cu alloy base layer, an Al or Al alloy conducting layer and a Cu or Cu alloy upper layer; (b) plating the upper layer with a Sn or Sn-Pb alloy layer; (c) selectively cutting away portions of the plated layer and upper layer with a skiving tool to expose a selected pattern of the conducting layer; and (d) removing part of the thickness of the conducting layer.</p>
申请公布号 EP0669648(A2) 申请公布日期 1995.08.30
申请号 EP19940108381 申请日期 1994.05.31
申请人 TECHNICAL MATERIALS, INC. 发明人 MENNUCCI, JOSEPH P.
分类号 H01L23/50;H01L21/48;H01L23/495;(IPC1-7):H01L21/48;H01L23/498 主分类号 H01L23/50
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