发明名称 |
Mask for exposing wafer with radiation and its exposing method. |
摘要 |
For exposing a wafer with radiation, a radiation exposure mask (10) is provided with at least two radiaiton exposure windows (A...D) each including mask pattern (1) of a small pattern area obtained by dividing a pattern area constituting an integrating circuit chip (11) to a plurality of small areas. A semiconductor wafer is exposed with radiation while the radiation exposure mask (10) is intermittently moved by a distance of the size of the small pattern area. |
申请公布号 |
EP0374701(B1) |
申请公布日期 |
1995.08.30 |
申请号 |
EP19890122948 |
申请日期 |
1989.12.12 |
申请人 |
HITACHI, LTD. |
发明人 |
KIMURA, TAKESHI;KUNIYOSHI, SHINJI;KISHIMOTO, AKIHIKO;SOGA, TAKASHI |
分类号 |
H01L21/30;G03F7/20;H01L21/027 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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