发明名称 Mask for exposing wafer with radiation and its exposing method.
摘要 For exposing a wafer with radiation, a radiation exposure mask (10) is provided with at least two radiaiton exposure windows (A...D) each including mask pattern (1) of a small pattern area obtained by dividing a pattern area constituting an integrating circuit chip (11) to a plurality of small areas. A semiconductor wafer is exposed with radiation while the radiation exposure mask (10) is intermittently moved by a distance of the size of the small pattern area.
申请公布号 EP0374701(B1) 申请公布日期 1995.08.30
申请号 EP19890122948 申请日期 1989.12.12
申请人 HITACHI, LTD. 发明人 KIMURA, TAKESHI;KUNIYOSHI, SHINJI;KISHIMOTO, AKIHIKO;SOGA, TAKASHI
分类号 H01L21/30;G03F7/20;H01L21/027 主分类号 H01L21/30
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