Apparatus and methods for processing substrates.

摘要

The disclosure relates to a structure and method for handling and processing wafers in a face down configuration. A robot insertion blade (46) supports a wafer (40) to be processed in a recess (53) having conically sloping wafer holding surfaces (59,60) which touch the wafer only at its outer periphery (41). Once positioned in the chamber, a set of three transfer fingers (76) with sloped contact surfaces (81) supported from a "C" shaped support assembly (106) raise the wafer adjacent to a susceptor bottom surface (159). A recess (143) in the face (139) of the susceptor (138) covering a large portion of the wafer is evacuated, compared to process chamber pressure, and when the differential pressure between the processing chamber and the evacuated recess behind the wafer can support the wafer, the transfer finger supports are lower and rotated out from under the wafer and susceptor assembly (106). The susceptor with the wafer attached by vacuum is then lowered to a processing location in contact with shadow rings (125) supported by the "C" shaped support assembly and opposite a gas distribution plate and manifold (26).