发明名称 |
Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same |
摘要 |
Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump. |
申请公布号 |
AU1847295(A) |
申请公布日期 |
1995.08.29 |
申请号 |
AU19950018472 |
申请日期 |
1995.02.13 |
申请人 |
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION |
发明人 |
ERNEST R NOLAN;DIANA CARTER DUANE;TODD H HERDER;THOMAS A BISHOP;KIMCUC T TRAN;ROBERT W FROEHLICH;RANDY L GERMAN;RICHARD D NELSON;CHUNG J LEE;MARK R BREEN;KATHRYN V KESWICK |
分类号 |
H01L23/52;H01L21/3205;H01L21/56;H01L21/60;H01L23/485;H01L23/498 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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