SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要

PURPOSE:To prevent the ingress of moisture from the outer periphery of a metal foil to the inside of a semiconductor device by letting a protection film press down the metal foil and by increasing the connecting strength of the metal foil. CONSTITUTION:A semiconductor device comprising metal foils 150a and 150c bonded to the top of output terminals 130a and 130c, opening 21a and 21c in part of metal foils 150a and 150c and a protection film 20 covering the surface of the semiconductor device containing the top of outer periphery of the metal foils 150a and 150c.