摘要 |
PURPOSE:To obtain the subject composition, comprising water, an abrasive and a specific polishing promoter and capable of improving the polishing speed, remarkably improving the quality of the polished surface and rapidly performing the flattening of an interlayer insulating film on a silicon substrate in high quality. CONSTITUTION:This composition comprises (A) water, (B) an abrasive and (C) a polishing promoter composed of a hydrazine compound. Furthermore, any one of hydrazine hydrate N2H4.H2O, hydrazine carbonate (N2H4).CO2, hydrazine acetate N2H4.CH3COOH, hydrazine hydrochloride N2.HCl and hydrazine sulfate N2H4.H2SO4 is preferably used as the component (C) and any one of silicon dioxide, cerium oxide, zirconium oxide and iron oxide is preferably used as the component (B). |