| 摘要 |
PURPOSE:To provide a wafer polishing device which enhances the handlability of a polishing plate and can provide wafers of high flatness. CONSTITUTION:In a polishing device which polishes wafers into high flatness, a polishing plate 1 comprises upper and lower plates 2, 3 made of a highly rigid material and closely stacked. The thickness of the polishing plate 1 is set to a value at which a polishing wafer with flatness quality can be obtained. The upper plate 2 is fitted in a top ring 4 via a plurality of rigid support members 7 each having a hooked plate support 7a and a top-ring holding portion 7b, and a predetermined gap is secured between a flexible thin plate 5 provided at the lower end of the top ring 4 and the plate 2. The plates 2, 3 have their mating surfaces flatly and smoothly finished and are closely secured to each other by means of the surface tension of a liquid. |
